PCB Pad Surface Finish: A ka ɲi ka kɛ, a ka baarakɛcogo ani a ka sanu sɛgɛsɛgɛri sangaɲɔgɔnma
1. Solder ɲuman ani solder lannaya (Kuun jɔnjɔn)
A be oksidi bali: Sanu (Au) ye nɛgɛ ye min be se ka yɛlɛma kosɔbɛ ani a tɛ oksidi nɔgɔman na fiɲɛ kɔnɔ. O tɛ, fɛn wɛrɛ minw ka teli ka kɛ ka pad yɔrɔw labɛn, i n’a fɔ Hot Air Solder Leveling (HASL), u ka teli ka yɛlɛma n’u be mara, o min be kɛ ni filimu ye min be yɛlɛma yɛlɛma.
A be sɔgɔli fanga sabati: Sanu yɔrɔ min saniyanin lo, o be se ka jigi koɲuman, o b’a to sɔgɔli be jɛnsɛn nɔgɔman na ani ka kɛ kelen ye, o min be sɔgɔli yɔrɔw dilan minw barika ka bon ani u be se ka la u la. O kɔrɔtanin lo kosɔbɛ SMT dilanni na min be kɛ ni ɔridinatɛri ye, o be dɔ bɔ fiɲɛw hakɛ la kosɔbɛ i n’a fɔ nɛnɛyɔrɔw ani nɛgɛjuruw.
2. A be kuran baarakɛcogo ɲuman sabati
A be kuran lase mɔgɔ ma koɲuman: Sanu be se ka kuran lase mɔgɔ ma koɲuman ani a sanfɛla ka fanga ka dɔgɔ kosɔbɛ. Ka ɲɛsin fɛnw ma minw ka frekansi ka bon i n’a fɔ kristali osilɛriw (kɛrɛnkɛrɛnniya la, minw be baara kɛ ni MHz tan wala kɛmɛ yɛrɛ ye), hali danfara misɛnninw be se ka bɔnɛ nafamanw wala tagamasiɲɛw ka tilenninya koo la.
Ɲɔgɔnkunbɛn basiginin: Sanu-nɔrɔnin be ni yɔrɔ nɔgɔman ye ani a pɛtɛnin lo (min be weele ko "niveling treatment"), o b’a to kuran be se ka ɲɔgɔn sɔrɔ cogo kelen na ani cogo basiginin na ni sanu-nɔrɔnin ɛlɛkitorodiw ye walima kristali osilitɛri ka solder balɔnw. O be dɔ bɔ tununi n’a ka yeelen na tagamasiɲɛw cituma na, o min kɔrɔtanin lo walisa lɛrɛ tagamasiɲɛ ka saniya ani ka basigi.
3. A bɛnnin lo ka sanu juru siri ɲɔgɔn na .
Kristali osilɛri dɔw minw ka bon kosɔbɛ wala minw labɛnna kɛrɛnkɛrɛnnin na (i n’a fɔ OCXO dɔw) b’a ɲini ka ɲɔgɔn minɛ kɔnɔnafɛnw ni kɛnɛmafɛnw cɛ sanu juru ɲumanw fɛ. O baara ka ɲi ka kɛ kristali osilɛri so ka pads kan.
Sanu-ni-sanu ɲɔgɔndan dɔrɔn lo be se ka ɲɔgɔndan lafiyaman ani basiginin sɔrɔ. Sanu-nɛgɛw be saratiw di o baara kama.
4. A be wagati jan kɛ a ka marali la
Komi sanu tɛ yɛlɛma nɔgɔman na, PCB minw be ni sanu ye, olu ka solderability be se ka to wagatijan kɔnɔ (a ka ca a la, saan kelen ni kɔ), o be se ka nɔgɔya don minanw marali la ani ka minanw yɛlɛma. O tɛ, nɛgɛ-plated boards be se ka solderability gwɛlɛyaw sɔrɔ kalo damanin kɔnɔ yɔrɔ jimanw na.
5. A bɛnnin lo ka yɛlɛma yɔrɔ caaman na
PCBA lajɛnba wagati la, a be se ka kɛ ko board ka ɲi ka yɛlɛma yɔrɔ caaman na ni funteniba ye. Sanu-nɛgɛda be to a nɔɔ na funteniba wagati la ani a tɛ yeelen nɔgɔya la wala ka "tin whiskers" bɔ i n'a fɔ tin nɔrɔnin, o b'a to pads be se ka solderability ɲuman mara reflow baara kelen kelen bɛɛ kɔ.
Sanu yɛlɛmacogo sugandi: ENIG
O sanu min be kɛ ka SMT kristali yɛlɛmayɛlɛmalanw dilan, o ye ENIG (Sanu min be jigi ni nikɛli ye min tɛ kuran ye).
Nikɛli (Ni) min be duguma: O kɔrɔtanin lo kosɔbɛ. Nikɛli yɔrɔ be baara kɛ i n’a fɔ barinan, a be jɛnsɛnni bali sanu yɔrɔ sanfɛla ni zira yɔrɔ jukɔrɔla (Cu) cɛ funteniba la, o min tun bena kɛ nɛgɛw cɛman (IMC) ye minw be nɔɔba to nɛgɛw ɲɔgɔndan ka mekaniki fanga kan.
Surface Gold (Au) Layer: Sanu yɔrɔ ka dɔgɔ kosɔbɛ (a ka ca a la 0.05-0.1μm) ani a be baara kɛ dɔrɔn ka nikɛli yɔrɔ tanga oksidi ma k’a sɔrɔ a be yɔrɔ ɲuman di min be se ka solder. Soderi wagati la, sanu be yɛlɛma joona ka don soderi kɔnɔ ani soderi yɛrɛ yɛrɛ be kɛ ni nɛgɛ ye min be nikɛli jukɔrɔla ni soderi (Sn) cɛ, o min be na ni Ni-Sn nɛgɛ ye.
A sanga ni furakɛcogo wɛrɛw ye minw be kɛ ka yɔrɔw suma .
Nafa ni kɔlɔlɔ minw be sɔrɔ yɔrɔw furakɛcogo la (Oscillateurs de crystal chip kama)
ENIG (Electroless Nickel Immersion Gold): A pɛtɛnin lo kosɔbɛ, a be se ka yɛlɛma koɲuman, a be se ka yɛlɛma, a be se ka sanu nɛgɛw siri ɲɔgɔn na; sɔngɔ ka gwɛlɛ dɔɔni.
HASL (Fɛɛn gwansan min be yɛlɛmayɛlɛma): A sɔngɔ ka dɔgɔ; yɔrɔ min tɛ kelen ye, o be se ka kɛ sababu ye ka fɛn misɛnninw -sodɛri kɛ ka ɲɛ; a be se ka kɛ oksidi ye.
OSP (Préservateur organique solderable): A sɔngɔ ka dɔgɔ, a be pɛtɛ kojugu; filimu min be mɔgɔ tanga, min tɛ se ka yɛlɛma yɛlɛma siɲɛ caaman; a ka surun.
Immersion Silver: A yɔrɔ pɛtɛnin lo, a be se ka sɔgɔ ka ɲɛ, a sɔngɔ ka dɔgɔ; a ka teli ka oksidi ni sulfidasiyɔn (nɛrɛmuguman), wagatijan-lafiya min ka dɔgɔ ni ENIG ta ye.
ENEPIG (Nikɛli min tɛ ni kuran ye ani min be ni paladiyɔmu ye min be don ni kuran ye): A be baara kɛ koɲuman, a ka ɲi kosɔbɛ ka sanu juru siri ɲɔgɔn na; sɔngɔ min ka ca ni bɛɛ ye.
Fɔkasurunya
Sanu nɛgɛ (ENIG) min be kɛ SMT kristali osilɛriw ka pads ye, o laɲini ye fɔlɔ ka la a la ko o fɛn jɔnjɔn min be “dusukun tantan” di sisitɛmu ma, o be se ka sɔgɔ ka ɲɛ yɔrɔnin kelen SMT dilan wagati la min be kɛ ni teliyaba ye, min be kɛ a yɛrɛ ma. A fana b’a to kuran ni mansinw be ɲɔgɔn minɛ wagatijan kɔnɔ ani u be se ka la a la.
Hali ni sanu nɔrɔli be wari caaman bɔ, o wari be se ka kɛ fɛɛn caaman ye minw be se ka la a la kosɔbɛ (i n’a fɔ kumaɲɔgɔnya minanw, izini ka baarakɛminanw, mobili ka ɔridinatɛri ani furakɛli minanw). A be dɛmɛ don ka sisitɛmu lɛrɛ tiɲɛ, ka baara kɛ tugun ni batch ye, wala hali ka fɛɛnw hakili jigi minw be sɔrɔ solder fiɲɛw fɛ.