Fɛɛn paramɛtiriw
|
Tilanyɔrɔ nimɔrɔ |
3dB yɔrɔ bonya (KHz) |
20dB yɔrɔ bonya (KHz) ka tɛmɛ |
Donni tununi (dB) |
Fanga dɔgɔyali (9 - 12MHz)(dB)miniti |
Donni/bɔli fanga (Ω) |
|
LTCA10,7MJ |
150±40 |
430 |
10 |
30 |
330 |
|
LTCV10,7MJ |
150±40 |
380 |
5.5±2.0 |
35 |
330 |
|
LTCA10.7MS3. |
180±40 |
520 |
7 |
30 |
330 |
|
LTCV10.7MS3. |
180±40 |
470 |
4.0±2.0 |
35 |
330 |
|
LTCA10.7MS2. |
230±50 |
570 |
6 |
30 |
330 |
|
LTCV10.7MS2. |
230±50 |
510 |
3.5±2.0 |
35 |
330 |
|
LTCA10.7MA5. |
280±50 |
650 |
6 |
30 |
330 |
|
LTCV10.7MA5. |
280±50 |
590 |
3.0±2.0 |
35 |
330 |
|
LTCV10.7MA20 |
330±50 |
700 |
3.0±2.0 |
30 |
330 |
|
LTCV10.7MA19 |
±miniti 175 |
950 |
3.0±2.0 |
20({1}}MHz) |
470 |
|
LTCS10.7MS3. |
180±40 |
470 |
4.5±2.0 |
30 |
330 |
|
LTCS10.7MS2. |
230±50 |
510 |
3.5±2.0 |
30 |
330 |
|
LTCS10.7MA5. |
280±50 |
590 |
3.0±2.0 |
30 |
330 |
|
LTCS10.7MA20 |
330±50 |
700 |
3.0±2.0 |
30 |
330 |
Fɛɛn sifaw
■ Sugandili ɲuman, min bɛnnin lo kumaɲɔgɔnya ma yɔrɔ fitininw na .
■ A lɔcogo ka surun ani a ka dɔgɔ .
■ Kuran ka baara tɛna nɔɔ to kɛnɛma kuran ka yɛlɛmaniw kan4.Standardized products
■ A bɛnnin lo ka bɛn ni Ics sifa caaman ye .
Aplikasiyɔnw
- SMD ka filtɛri seramiki HCCF3 be baara kɛ ni hakilimanw ka soow kɔlɔsili ani dumunikɛminanw ye.
Fɛɛn nafaw
3mm×3mm QFN-32 pake min be se ka don mɔgɔ la
Sɔngɔ ɲuman 30% dɔgɔya BOM sɔngɔ vs fadenyabolow
dipilomu
SMD ka filtɛri seramiki HCCF3 be RoHS ka sariyaw labato.
Ɲiningali
Q1: Yala a be se ka kumakanw mara wa?
A: Ɔnhɔn! On-chip AI teliyalan be 20+ kan cikanw lɔn(misali la, "Yɛlɛn", "Yeelen dɔgɔya").
Q2: Kuran min be bɔ, o ka dɔgɔ cogo di?
A: 0.005mA dɔrɔn lo be labɛnna, a be boli 3+ saanw na warigwɛ seliliw kan (10 kunu/tile).
Tagasogow: smd seramiki filɛri hccf3, Sinuwa smd seramiki filɛri hccf3 dilanbagaw, feerekɛlaw
